Investigation of The Wetting Behaviours of SAC305 and SAC405 Ternary Lead-Free Solder Alloys on Cu Substrate
Hasan ABUT Ahmet Mustafa Erer Ziyaddin RECEBLİ
AbstractIn present study, wetting behaviours of molten Sn-3Ag0.5Cu (SAC305) and Sn-4Ag-0.5Cu (SAC405) ternary Pb-free solder alloy were investigated at predetermined temperatures (230, 250 and 280 oC) on Cu substrate. The Contact angles of alloys were measured by using of the sessile drop method. The lowest value of contact angle for SAC405 was 41.05° at 280 oC. Microstructures, inter-metallic phases (IMC) of alloys were examined by optic microscope and scanning electron microscope (SEM+EDX), X-ray diffraction (XRD) and differential scanning calorimeter (DSC). The amount of Ag in the molten Pb-free solder alloy reacts with Sn to occur intermetallic compounds (IMCs) on the interface.