Determination of cutting parameters of silicon ingot by using fuzzy logic
Savaş Öztürk Cihan Mizrak Erhan Kayabasi Hüseyin Kurt Erdal Çelik
AbstractA fuzzy logic (FL) simulation was used to estimate surface roughness values (Ra) for an n-type single crystalline Silicon (c-Si) ingot cutting operation with a Diamond Wire Saw (DWS) cutting machine. The three parameters affecting surface quality: spool speed, z axis speed and oil ratio in a coolant slurry were assumed as input data for DWS cutting operation. Other parameters such as wire tension, wire thickness, and work piece diameter were assumed as constant. The DWS cutting machine performed 28 cutting operations with different values of the selected three parameters and new cutting parameters were derived for different cutting conditions to achieve the best surface quality by using FL. Wafers 400 μm thick were cut from a same n-type c-Si ingot in a STX 1202 DWS cutting machine. Ra values were measured three times from different regions of the wafers. In present study Ra values corresponding to the cutting parameters, and proper cutting parameters for specific Ra values were determined for DWS cutting using FL.