The Effect of Boron Carbide Amount on Microstructure and Electrical Properties of Cu-B4C Composite Materials
Ozkan Eski Serkan Islak Cigdem Urayli
AbstractIn this study, the effects of boron carbide (B4C) addition on mechanical and physical properties such as microstructure, hardness and density of hot pressed copperboron carbide (Cu-B4C) composites were investigated. To improve the mechanical properties of commercial copper (C) powders having a particle size of 40μm, B4C having a particle size of 40μm, of 2,5, 5, 7,5, 10% by weight was added. Cu-B4C composites were sintered to argon atmosphere at 6500C, 7500C and 8500C for 4 minutes. The electrical conductivity values of the sintered products were measured after examination with the presence of B4C, optical microscope, X-ray diffraction analysis technique and SEM-EDS. In the images obtained, B4C was found to be homogeneously dispersed in the copper matrix. As the ratio of B4C increased, the hardness of the composites increased and the density decreased.