Investigation of Solutions for Micro and Nano Sized Problems in Preparation of Silicon Substrates Produced for Electronic Applications
Erhan Kayabasi Savas OZTURK Erdal CELIK Huseyin Kurt
AbstractPresent study includes an overview about problems and overcoming methods of micro and nano sized defects came out during production of crystalline silicon (c-Si) substrates for electronic applications. All surface treatment steps such as diamond wire saw (DWS), lapping, polishing, micro and nano sized shaping on surface are performed respectively. Defects occurred during and after the operations and reasons of these were investigated and given via the of scanning electron microscope (SEM), reflectance and roughness measurements. Solutions methods explored and results after application of solution methods were evaluated. Reasonable solutions were discovered in order to overcome the problems behind the production a defect-free Si substrate surface for many electronic applications.