[1] F. Omaç, D. Ozyurek and M. Erer, " Investigation of the Wetting Properties of Ternary Lead-Free Solder Alloys on Copper Substrate", Acta Physica Polonica A, 131, 165-167 (2017). [2 A.M. Erer, Wetting Behaviors and Interfacial Properties of Molten SAC300, SAC305 and SAC0307 Pb-free Solder Alloys, " Technological Applied Sciences", 12, (4), 163-169, (2017).
Okan Uyanık Ahmet Mustafa Erer Yunus Türen
AbstractThis study reports the investigation on indium addition into Sn–3Ag-0.5Cu ternary lead-free solder to improve its various performances. The effects of indium addition on wettability of the solder alloy was studied. The results showed that when the addition of indium was 1 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In solder was negligible, but the contact angles (θ) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere [1]. Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The lowest θ was obtained as 35,55°for Sn–2Ag-0.5Cu–1In alloy at 310 °C.